| 00:00:00 | Abrasives - How size and shape of abrasive affects the efficiency of the wire saw cutting process |
| 00:01:37 | Abrasives - How size and shape of abrasive affects the efficiency of the wire saw cutting process |
| 00:01:48 | Semiconductor Wafers |
| 00:02:13 | Wire Saw Cutting |
| 00:02:37 | Wire Saw Abrasive |
| 00:03:21 | How to Characterize Abrasives |
| 00:03:56 | Sample Flow - Measurement |
| 00:05:02 | Flat Sheath Flow Formation |
| 00:05:21 | Particle Size Distributions |
| 00:06:01 | Volume vs. Number Distribution |
| 00:07:14 | Comparison to Traditional Methods |
| 00:08:28 | Comparison to Traditional Methods |
| 00:09:21 | Flow Particle Image Analysis |
| 00:10:14 | Abrasive Efficiency |
| 00:11:05 | Abrasives Characterization |
| 00:11:53 | Abrasives Shape and Performance |
| 00:12:04 | Abrasives – Fines Detection |
| 00:13:00 | Abrasives – Buildup of Fines |
| 00:14:10 | Recycling Abrasive Material |
| 00:14:30 | Recycling Abrasive Material |
| 00:14:51 | Benefits of Image Analysis |
| 00:16:03 | Conclusions |
| 00:16:56 | Contact Information |
Particle size aned shape of the abrasive slurries used in silicon wafer cutting operations is important in defining the viscosity of the cutting fluid and the cutting effectiveness. Analysis during slurry use can aid production consistency and speed.